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Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator
期刊文章

Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

Jer-Liang Andrew Yeh, Hongrui JiangNorman C. Tien
Journal of Microelectromechanical Systems, 卷.8(4), 頁碼.456-465
12/1999

摘要

Mechanical Engineering Electrical and Electronic Engineering
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining.

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