摘要
In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow process significantly affect the mechanical properties of the devices. In this study, In solder and Ni under-bump metallization (UBM) were chosen to investigate the solid–liquid interfacial reaction under an isothermal reflow process. Two types of IMCs, uniform and scallop-type, were formed in turn after being reflowed at three different temperatures, 220°C, 250°C, and 280°C. Elemental analysis has revealed that the compositions of both types of IMCs are nearly the same and were eventually identified as Ni 3 In 7 . By the growth rate of IMC formation, the mechanism of the growing process was proposed to be a diffusion-controlled process. The activation energy (Q) of the IMC formation was calculated to be 83.8 kJmol.