Abstract
Sn-In-Zn alloys are promising Pb-free solders. Their interfacial reactions with Ag and Ni substrates at 230 °C are experimentally determined using reaction couple techniques. The reaction path is liquid/Ag in the Sn-20 wt%In-x wt%Zn/Ag couple when the Zn content is less than 0.7 wt%, and the reaction path changes to liquid/ε-AgZn 3 /γ-Ag 5 Zn 8 /-AgZn/Ag when the Zn content is 5 wt%Zn. The reaction path is liquid/Ni 3 Sn 4 /Ni when the Zn content is less than 1.0 wt%, and the reaction path becomes liquid/γ-Ni 5 Zn 21 /(Ni 3 Sn 4 )/Ni when the Zn content is higher than 2.0 wt%. The reaction paths in both two kinds of couples are affected by the Zn addition. © 2011 Elsevier B.V. All rights reserved.