Abstract
The reaction sequence occurring between a Ag-28wt.%Cu filler material and a Ni substrate during the brazing process has been investigated by studying liquid diffusion couples. The reaction layer structure is liquid/(Cu,Ni)/ Ni. The composition profile across the reaction layers was determined by electron probe microanalysis. The diffusion path was obtained using the phase diagram and the experimental results from this study. Based on these results, it is clear that the (Cu,Ni) layer observed in the brazed joint of the pin-grid arrays was formed as a result of liquid diffusion prior to solidification. © 1993.