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Investigation of Ag-TiO2 Interfacial Reaction of Highly Stable Ag Nanowire Transparent Conductive Film with Conformal TiO2 Coating by Atomic Layer Deposition
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Investigation of Ag-TiO2 Interfacial Reaction of Highly Stable Ag Nanowire Transparent Conductive Film with Conformal TiO2 Coating by Atomic Layer Deposition

Ming-Hua Yeh, Po-Hsun Chen, Yi-Ching Yang, Guan-Hong ChenHsueh-Shih Chen
ACS Applied Materials and Interfaces, 卷.9(12), 頁碼.10788-10797
03/2017

摘要

Ag NW ALD Kirkendall TCF TiO2 Materials Science (all)
The atomic layer deposition (ALD) technique is applied to coat Ag nanowires (NWs) with a highly uniform and conformal TiO 2 layer to improve the stability and sustainability of Ag NW transparent conductive films (TCFs) at high temperatures. The TiO 2 layer can be directly deposited on Ag NWs with a surface polyvinylpyrrolidone (PVP) coat that acts a bed for TiO 2 seeding in the ALD process. The ALD TiO 2 layer significantly enhances the thermal stability at least 100 fold when aged between 200-400 °C and also provides an extra function of violet-blue light filtration for Ag NW TCFs. Investigation into the interaction between TiO 2 and Ag reveals that the conformal TiO 2 shell could effectively prevent Ag from 1D-to-3D ripening. However, Ag could penetrate the conformal TiO 2 shell and form nanocrystals on the TiO 2 shell surface when it is aged at 400 °C. According to experimental data and thermodynamic evaluation, the Ag penetration leads to an interlayer composed of mixed Ag-Ag 2 O-amorphous carbon phases and TiO 2-x at the Ag-TiO 2 interface, which is thought to be caused by extremely high vapor pressure of Ag at the Ag-TiO 2 interface at a higher temperature (e.g., 400 °C).

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