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Investigation of analytical solutions for bonded structures by photomechanical methods
Journal article   Peer reviewed

Investigation of analytical solutions for bonded structures by photomechanical methods

W.-C. Wang and J.-S. Hsu
Strain, Vol.42(2), pp.107-116
05/2006

Abstract

Bonded structures Finite element method Lateral displacement Moiré interferometry Photoelasticity Thermal stresses
In this paper, both photoelasticity and moiré interferometry were successively incorporated with finite element method to investigate the predicted thermal stresses and lateral displacement of bonded structures calculated from different theories. It was found that the distributions of moment and transverse force play significant roles in making different values of thermal stresses in the adherends by authors' and Suhir's 1986 theories. On the other hand, the values of lateral displacement obtained from different theories are almost identical. © 2006 Blackwell Publishing Ltd.

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