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Investigation of vibration characteristics of bonded structures by time-averaged electronic speckle pattern interferometry
Journal article   Peer reviewed

Investigation of vibration characteristics of bonded structures by time-averaged electronic speckle pattern interferometry

Wei-Chung Wang and Jiong-Shiun Hsu
Optics and Lasers in Engineering, Vol.48(10), pp.958-965
10/2010

Abstract

Amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) Bonded structures Modal testing technique
In this paper, the vibration characteristics of bonded structures were experimentally investigated by incorporating amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) with modal testing technique. A special casting procedure was employed to manufacture the naturally bonded structures to avoid the influence resulted from the adhesive. Vibration characteristics of bonded structures with different geometrical combinations of constituent adherends and the influence of presence of an interfacial crack were investigated. © 2010 Elsevier Ltd.

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