Abstract
The feasibility of studying dynamical changes in metal/silicon and ion-implanted silicon thin films by cross-sectional transmission electron microscopy with intermittent annealings in N 2 ambient up to 900 °C is demonstrated. Interactions of nickel thin films with oxidation-induced stacking faults and fluorine bubbles, the evolution of microstructural defects and solid-phase epitaxial growth in BF + 2 -implanted silicon are provided as examples. The technique may be applied to clarify a number of important issues encounered in the study of the reactions and diffusion of thin films and obtain information otherwise unattainable.