Liquid‐rubber‐modified epoxy adhesives cured with dicyandiamide. II.—Morphology and adhesion strengths

期刊文章

同儕審查

Yu‐Der Lee, Shi‐Kwun Wang 和 Wei‐Kuo Chin

Journal of Applied Polymer Science, 卷.33(6), 頁碼.2267-2267

1987

摘要

Chemistry (all)

Surfaces

Coatings and Films

Polymers and Plastics

Materials Chemistry

1 檢視次數

題名: Liquid‐rubber‐modified epoxy adhesives cured with dicyandiamide. II.—Morphology and adhesion strengths
創作者：: Yu‐Der Lee (作者) - National Tsing Hua University
Shi‐Kwun Wang (作者) - National Tsing Hua University
Wei‐Kuo Chin (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 1987
出版資訊: Journal of Applied Polymer Science, 卷.33(6), 頁碼.2267-2267
語言: 英語