Liquid‐rubber‐modified epoxy adhesives cured with dicyandiamide. I. Preparation and characterization

期刊文章

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Yu‐Der Lee, Shi‐Kwun Wang 和 Wei‐Kuo Chin

Journal of Applied Polymer Science, 卷.33(6), 頁碼.2265-2265

1987

摘要

Chemistry (all)

Surfaces

Coatings and Films

Polymers and Plastics

Materials Chemistry

url

https://doi.org/10.1002/app.1987.070330636檢視

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題名: Liquid‐rubber‐modified epoxy adhesives cured with dicyandiamide. I. Preparation and characterization
創作者：: Yu‐Der Lee (作者) - National Tsing Hua University
Shi‐Kwun Wang (作者) - National Tsing Hua University
Wei‐Kuo Chin (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 1987
出版資訊: Journal of Applied Polymer Science, 卷.33(6), 頁碼.2265-2265
語言: 英語