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Low Equivalent Oxide Thickness and Leakage Current of pGe MOS Device by Removing Low Oxidation State in GeOx with H2 Plasma Treatment
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Low Equivalent Oxide Thickness and Leakage Current of pGe MOS Device by Removing Low Oxidation State in GeOx with H2 Plasma Treatment

Dun-Bao Ruan, Kuei-Shu Chang-Liao, Shih-Han Yi, Hsin-I YehGuan-Ting Liu
IEEE Electron Device Letters, 卷.41(4), 頁碼.529-532
04/2020

摘要

GeOx hydrogen plasma treatment oxidation state pGe MOS device Electronic Optical and Magnetic Materials Electrical and Electronic Engineering
A low equivalent-oxide-thickness of 0.58 nm and a low gate leakage current density of &siml 2× 10-5 A/cm <sup>2</sup> at V <sub>G</sub> = V <sub>FB</sub> - 1 V in p-substrate Ge (pGe) MOS device can be simultaneously achieved by a hydrogen plasma (H <sup>∗</sup> ) treatment on GeO <sub>2</sub> interfacial layer (IL). It is found that the removal of GeO <sub>x</sub> with low oxidation state in GeO <sub>2</sub> IL play crucial roles on electrical characteristics of pGe MOS device. Through a H <sup>∗</sup> treatment, the electrical and reliability characteristics are improved by a GeO <sub>2</sub> IL with high oxidation state. Therefore, a GeO <sub>2</sub> IL with H <sup>∗</sup> treatment is promising for high performance pGe MOS devices.

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