摘要
A low-temperature bonding process using silver nanoparticles paste has been developed in air at temperatures of 150–250°C under 5 MPa. The resistivity and hardness of the sintered Ag layer significantly improved when the sample was isothermally annealed above 180°C. The microstructural evolution in the Ag nanoparticles paste at various bonding temperatures has been characterized, and their corresponding bonding strength analyzed. The results revealed that the joints can be successfully bonded at the lowest temperature of 150°C for 1 h and at 180°C for 10 min. No damage was found at the bonded interface after shear tests. In addition, thermal cycle tests were performed, and the microstructure evolution of the joints remained the same after the thermal cycle tests.