摘要
The rapid evolution of the Internet of Things (IoT) requires flexible electronics to have high computing performance and good environmental stability, rather than just simple flexibility. However, traditional polymer and metal substrates are limited by their low processing temperatures or crystallinity, restricting the integration of advanced functional materials. Mica, a natural layered mineral, has recently emerged as an inorganic platform, "MICAtronics", bridging the gap between rigid wafers and soft electronics. This review provides a comprehensive roadmap of mica electronics, tracing its evolution from fundamental van der Waals epitaxy to wafer-scale system integration. First, we explain the "quasi-van der Waals epitaxy" growth mechanisms. This method allows the high-quality growth of many different materials, including 3D complex oxides and nitrides, without the strict limits of lattice matching. Next, we discuss the progress in large-scale production. We highlight self-separation technologies that allow substrate recycling and low-cost batch processing for future industrial use. We also systematically review the functional applications, grouping them into power management, logic computing, sensing, and connectivity. Finally, we discuss new research directions such as intercalation engineering and heterogeneous integration. We expect that mica will be an important foundation for fully integrated, all-inorganic flexible electronic systems.