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Magnetic wireless interlayer transmission through perpendicular MTJ for 3-D IC applications
Journal article   Peer reviewed

Magnetic wireless interlayer transmission through perpendicular MTJ for 3-D IC applications

Liang-Shun Chang, Ching-Hua Wang, Kun-Yu Dai, Kuei-Hung Shen, Ming-Jinn Tsai, Chrong Jung Lin and Ya-Chin King
IEEE Transactions on Electron Devices, Vol.61(7), pp.2480-2485
2014

Abstract

Contactless 3-D IC integration magnetic RAM (MRAM) magnetic tunneling junction (MTJ) Non-Volatile Memory (NVM)
A new wireless 3-D integrated circuit connection method, magnetic-sensing transmission interface (MTI), is reported for the first time. Signal transmission through the MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a microcoil transmitter is successfully demonstrated. This new contactless magnetic signal transmission method featuring low-power, wide-bandwidth, and multilayer wireless data transmission is a viable candidate for future 3-D circuit integration technology. © 1963-2012 IEEE.

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