摘要
A new wireless 3-D integrated circuit connection method, magnetic-sensing transmission interface (MTI), is reported for the first time. Signal transmission through the MTI implemented by placing a high-sensitivity sensor with perpendicular magnetic anisotropy on the top of a microcoil transmitter is successfully demonstrated. This new contactless magnetic signal transmission method featuring low-power, wide-bandwidth, and multilayer wireless data transmission is a viable candidate for future 3-D circuit integration technology. © 1963-2012 IEEE.