Mechanically modeling chemical mechanical planarization from wafer to molecular scales: a review and discussion of future direction

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Mechanically modeling chemical mechanical planarization from wafer to molecular scales: a review and discussion of future direction

K.-T. Yeh 和宏營蔡

Journal of Mechanics, 卷.40, 頁碼.769-773

2024

DOI: https://doi.org/10.1093/jom/ufae055

摘要

CMP;Greenwood–Williamson model;mixed lubrication;molecular scale

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詳細資料

題名: Mechanically modeling chemical mechanical planarization from wafer to molecular scales: a review and discussion of future direction
創作者：: K.-T. Yeh (作者)
宏營蔡 (作者)
學術資源類型: 期刊文章
出版日期: 2024
出版資訊: Journal of Mechanics, 卷.40, 頁碼.769-773
語言: 英語