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Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset
Journal article

Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset

世杰 張
2025

Abstract

2.5D/3.5D packaging technology;bridge chip;low-cost;miniaturized;Programmable

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