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Nanoscale Copper and Copper Compounds for Advanced Device Applications
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Nanoscale Copper and Copper Compounds for Advanced Device Applications

Lih-Juann Chen
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 頁碼.1-7
04/2016

摘要

Condensed Matter Physics Mechanics of Materials Metals and Alloys
Copper has been in use for at least 10,000 years. Copper alloys, such as bronze and brass, have played important roles in advancing civilization in human history. Bronze artifacts date at least 6500 years. On the other hand, discovery of intriguing properties and new applications in contemporary technology for copper and its compounds, particularly on nanoscale, have continued. In this paper, examples for the applications of Cu and Cu alloys for advanced device applications will be given on Cu metallization in microelectronics devices, Cu nanobats as field emitters, Cu 2 S nanowire array as high-rate capability and high-capacity cathodes for lithium-ion batteries, Cu-Te nanostructures for field-effect transistor, Cu 3 Si nanowires as high-performance field emitters and efficient anti-reflective layers, single-crystal Cu(In,Ga)Se 2 nanotip arrays for high-efficiency solar cell, multilevel Cu 2 S resistive memory, superlattice Cu 2 S-Ag 2 S heterojunction diodes, and facet-dependent Cu 2 O diode.

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