Logo image
On-Wafer FinFET-Based 3-D E-Beam Detector Cube for In Situ Monitoring of Advanced Lithography Processes Beyond 5 nm
期刊文章   同儕審查

On-Wafer FinFET-Based 3-D E-Beam Detector Cube for In Situ Monitoring of Advanced Lithography Processes Beyond 5 nm

Yu-Jie Teng, Ho-Ting Chao, Wei Chang, Burn Jeng Lin, Yue-Der Chih, Jonathan Chang, Chrong-Jung Lin 和 Ya-Chin King
IEEE transactions on electron devices, 卷.71(6), 頁碼.3739-3745
01/06/2024
Web of Science ID: WOS:001214277100001

摘要

3-D e-beam detector cube (3D-EDC) Couplings Detectors e-beam lithography electron beam (e-beam) Electrons FinFET technologies Logic gates Metals Monitoring Sensors
An on-wafer 3-D electron beam (e-beam) detector cube for in situ monitoring of advanced lithography processes is presented. The proposed detector array stands out because of its full compatibility with the FinFET CMOS logic process, heightened sensing resolution, and capability for battery-less sensing. The in situ stored sensed signal is accessible through offline, nondestructive wafer-level tests. To increase its depth resolution, lower layer metal stack in the CMOS process can be employed. The on-chip e-beam detector cube can faithfully produce readout signals, thereby enabling in-tool monitoring of critical parameters, such as energy and scattering response. This innovation carries particular significance for advanced lithographical systems for CMOS technologies beyond the 5-nm node.

相關連結

指標

1 檢視次數

詳細資料

Logo image