Abstract
Literaturally, the local-global finite element analysis technique plays a very important role in the area array packaging. This technique applies a finite element based method to calculate the geometrical data and elastic/plastic material properties of the equivalent beam model that is used to elastically and plastically simulate the 3-D local model. In this study, the underlying goal is to propose an improved equivalent model for the use in the local/global analysis, and most importantly, provide a systematic procedure in approaching this equivalent model. In addition, the choice of the equivalent beam model(i.e., either solid circular beam or the thin-walled circular pipe) will be also extensively investigated. Since the configuration of the solder joint is far from being close to a "beam-like" structure, defining the corresponding equivalent beam exists a great level of difficulties. Hence, in order to remove the possible difficulties, a comparatively effective way is proposed by incorporating the analytical derivations and optimization approaches. To this end, one practical application is presented to substantiate the proposed methodology.