Optimizing Warpage in Semiconductor Packaging Using GA-NN and Conditional GAN with Explainable AI

Journal article

Yan-Cheng Lin, Tang-Yuan Chen, Chen-Chao Wang, Chin-Pin Hung and 宏鍇王

Computers & Industrial Engineering

2025

Abstract

GA-NN;CTGAN

1 Record Views

Title: Optimizing Warpage in Semiconductor Packaging Using GA-NN and Conditional GAN with Explainable AI
Creators - without role: Yan-Cheng Lin
Tang-Yuan Chen
Chen-Chao Wang
Chin-Pin Hung
宏鍇王
Identifiers: 9957775940306774
Academic Unit: Executive Cross-Discipline Master Program for Intelligent Manufacturing, Office of Academic Affairs, National Tsing Hua University
Language: English
Resource Type: Journal article
Publication Details: Computers & Industrial Engineering