摘要
This research reviews the application of computational mechanics on the properties of nano/micro scaled thin films, in which the application of different computational methods is included. The concept and fundamental theories of concerned applications, material behavior estimations, interfacial delamination behavior, strain engineering, and multilevel modeling are thoroughly discussed. Moreover, an example of an interfacial adhesion estimation is presented to systematically estimate the related mechanical reliability issue in the microelectronic industry. The presented results show that the peeled mode fracture is the dominant delamination behavior of layered material system, with high stiffness along the bonding interface. However, the shear mode fracture being dominated as the polymer cover plate with low moduli is considered. The occurrence of crack advance is also significantly influenced by the interfacial crack length and applied loading. Therefore, this paper could serve as a guideline of several engineering cases with the assistance of computational mechanics.