Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

期刊文章

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Y. T Lin, C. T. Peng 和 K. N. Chiang

ASME Transaction, Journal of Electronic Packaging ASME Transaction, Journal of Electronic Packaging, 卷.124(3), 頁碼.234-239

2002

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題名: Parametric Design and Reliability Analysis of WIT Wafer Level Packaging
創作者：: Y. T Lin (作者) - National Tsing Hua University
C. T. Peng (作者) - National Tsing Hua University
K. N. Chiang (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 2002
出版資訊: ASME Transaction, Journal of Electronic Packaging ASME Transaction, Journal of Electronic Packaging, 卷.124(3), 頁碼.234-239
語言: 中文