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Performance Evaluation of Silicon and Germanium Ultrathin Body (1 nm) Junctionless Field-Effect Transistor with Ultrashort Gate Length (1 nm and 3 nm)
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Performance Evaluation of Silicon and Germanium Ultrathin Body (1 nm) Junctionless Field-Effect Transistor with Ultrashort Gate Length (1 nm and 3 nm)

Yi-Ruei Jhan, Vasanthan Thirunavukkarasu, Cheng-Ping Wang and Yung-Chun Wu
IEEE Electron Device Letters, Vol.36(7), pp.654-656
01/07/2015

Abstract

Germanium Junctionless FET (JLFET) Ultra-thin body (UTB)
Silicon (Si) and Germanium (Ge) ultrathin body junctionless field-effect transistor (UTB-JLFET) with L-{G}= 1 nm and L-{G} = 3 nm were demonstrated by solving the coupled drift-diffusion and density-gradient model. The simulation results show that the Si and Ge channel can be used in ultrashort channel device as long as UTB is employed. As UTB is employed, ultra-short channel device does not need to follow an empirical rule of T-{m ch} = extrm {L}-{G}/3. Furthermore, Ge UTB-JLFET 6T-SRAM cell has reasonable static noise margin value of 149 mV. The circuit performances reveal that UTB-JLFET can be used for sub-5-nm CMOS technology nodes.

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