Abstract
The integration of the classical photoelastic theory and the modern digital imaging processing technique was used to study the interacting effects of cracks perpendicular to a bimaterial interface. The stress intensity factors associated with the stress fields were then obtained. In all experiments performed, specimen materials of epoxy resin were self cast in a specially designed mould. To model the bimaterial correctly, two materials were naturally cemented without the use of adhesives. Five different elastic constants were obtained by adjusting the amount of hardner and plasticizer in the resin. Twenty five specimens were prepared. The study considered the effects of different arrangements of crack locations, for example, cracks situated either on the softer or stiffer materials, on the variation of stress intensity factors of crack tips, near and far from the bimaterial interface, versus the material constants.