Abstract
An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N-(4-hydroxyphenyl)maleimide and 3-glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5-10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI -30) to bisphenol-A-based epoxy resins. © 2005 Wiley Periodicals, Inc.