Logo image
Process Sensitivity of 355 nm-Laser-Induced High-Concentration Aluminum Doping for P-Type Layer in Semi-Insulating 4H-SiC
期刊文章   同儕審查

Process Sensitivity of 355 nm-Laser-Induced High-Concentration Aluminum Doping for P-Type Layer in Semi-Insulating 4H-SiC

Chang-Shan Shen, Wei-Chi Aeneas Hsu, Ming-Chun Hsu, Hong-Yi Guo, Yu-Xian Liu, Hua-Yan Chen, Guan-Jie Liu, Duong Minh Hoang 和 Tsun-Hsu Chang
IEEE transactions on semiconductor manufacturing, 卷.38(3), 頁碼.728-733
01/08/2025
Web of Science ID: WOS:001563976700016

摘要

Absorption Aluminum annealing dopant activation Doping Laser beams laser doping Measurement by laser beam Power lasers Sensitivity Silicon Silicon carbide Surface emitting lasers Surface treatment
The advancement of high-power 4H-SiC devices demands innovative solutions to address doping challenges. This study introduces a 355 nm DPSS Nd:YAG laser scanning doping as a method for aluminum doping and surface modification in semi-insulating 4H-SiC, addressing the limitations of conventional ion-implantation techniques. Through a systematic investigation of laser fluence, we identify process windows that balance carrier activation and material properties. At a fluence threshold of 2.588 J/cm2, effective Al activation was achieved, while higher fluences induce polysilicon formation, as verified by Raman, GIXRD, SIMS, and Hall measurements. Remarkably, laser processing generates a multilayer surface structure-graphite, polysilicon, poly-SiC, and 4H-SiC-potentially reducing the barrier height. This method demonstrates significant potential for fabricating high-performance p-type contacts on 4H-SiC. These findings highlight the sensitivity and versatility of laser doping, offering critical insights into next-generation SiC fabrication strategies.

相關連結

指標

1 檢視次數

詳細資料

Logo image