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Processing copper and silver matrix composites by electroless plating and hot pressing
Journal article   Peer reviewed

Processing copper and silver matrix composites by electroless plating and hot pressing

Shou-Yi Chang, Jiunn-Horng Lin, Su-Jien Lin and Theo Z. Kattamis
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol.30(4), pp.1119-1136
1999

Abstract

A simple process was developed to fabricate ceramic-reinforced copper and silver matrix composites by electroless plating and hot pressing at 873 K and 300 MPa, in air. Composites were produced containing 10 to 40 vol pct ceramic reinforcements of different sizes and shapes including silicon carbide whiskers (SiC w ), alumina particles (Al 2 O 3p ), carbon short fibers (Carbon sf ), and Saffil short fibers (Saffil sf ) (3.8 pct SiO 2 -96.2 pct Al 2 O 3 ) uniformly distributed within the matrix. The hardness and bending strength of the composites were much higher than those of the pure matrices. The electrical conductivity, measured by a four-point probe method, was similar to that of traditional CdO/ Ag electrical contact materials. The surface morphologies and cross-sectional microstructures of the arc-eroded Al 2 O 3p /Ag composites were similar to those of conventional CdO/Ag and SnO 2 /Ag and exhibited a good arc-erosion resistance. These composites combine the high strength and elevated-temperature stability of the ceramic reinforcements with the good electrical and thermal conductivity of the two metallic matrices.

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