Logo image
RESIST HARDENING USING A CONFORMABLE MOLD.
期刊文章

RESIST HARDENING USING A CONFORMABLE MOLD.

F.S. Lai, B.J. LinY. Vladimirsky
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 卷.4(1), 頁碼.426-429
01/1986

摘要

Condensed Matter Physics Electrical and Electronic Engineering
The novolak-based resist image is thoroughly hardened by baking with a conformable mold which is formed by spin coating polymethylmethacrylate (PMMA) over the novolak image. Therefore, instead of a deep-UV hardening exposure or a plasma hardening step followed with a high temperature bake, this hardening process consists of a PMMA coating followed with a high temperature bake. Experimental results show that hardening took place throughout the bulk of the resist. The resist profile remains intact after a 200 degree C bake and a second novolak resist image can be delineated on top of the hardened image without any mutual interaction, whereas conventional deep-UV or plasma hardening technique can only harden the resist surface layer. Large features hardened with these conventional techniques tend to deform. Recent results showed stability of resist profile for baking temperature up to at least 500 degree C in a nitrogen flushed furnace. The lateral dimension change of the resist image after resist hardening using a conformable mold (RHCM) and 500 degree C bake was shown to be less than 0. 05 mu m.

相關連結

指標

1 檢視次數

詳細資料

Logo image