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Real-time control of ion density and ion energy in chlorine inductively coupled plasma etch processing
Journal article   Peer reviewed

Real-time control of ion density and ion energy in chlorine inductively coupled plasma etch processing

Cheng-Hung Chang, Keh-Chyang Leou, Chaung Lin, Tsan-Lang Lin, Chih-Wei Tseng and Chuen-Horng Tsai
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol.21(4), pp.1183-1187
07/2003

Abstract

The real-time control of both ion density and ion energy in chlorine ICP to etch a polysilicon film was experimentally studied. The TRG-OES was used to measure positive ion density. An I-V probe mounted immediately below the E chuck was adopted to sense rms rf voltage which is proportional to the sheath voltage. Experimental results showed that the closed-loop control had a better repeatability of plasma parameters than the open-loop control.

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