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Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method
Journal article   Open access   Peer reviewed

Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method

Li-Yin Hsiao and Jenq-Gong Duh
Journal of Electronic Materials, Vol.35(9), pp.1755-1760
09/2006

Abstract

(Ag,Cu)3Sn (Ag,Cu)4Sn Nanoparticles Sn-3.5Ag-0.5Cu
Sn-3.5Ag-0.5Cu nanoparticles were synthesized by chemical precipitation with NaBH 4 . By using x-ray diffraction and transmission and scanning electron microscopy, the microstructural characteristics of particle growth were evaluated. The results indicated that the primary particles after precipitation were (Ag,Cu) 4 Sn, with a size of 4.9 nm. (Ag,Cu) 4 Sn was transformed into (Ag,Cu) 3 Sn, when the total amount of Sn contributed from both (Ag,Cu) 4 Sn and Sn covering the (Ag,Cu) 4 Sn overtook that of (Ag,Cu) 3 Sn. The final particle size of polycrystalline particles was 42.1 nm owing to the depletion of Sn atoms in the solution. Nucleation and growth mechanisms of Sn-3.5Ag-0.5Cu nanoparticles are also discussed and proposed.
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