RuAl Intermetallic Compound of Low Resistivity Scaling and High Thermal Stability as Potential Interconnect Metallization

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Yi-Ying Fang, Yung-Hsuan Tsai, Yu-Lin Chen, Dun-Jie Jhan, Ming-Yen Lu, Pei-Yuin Keng 和守一張

Applied Physics Letters, 卷.124(14)

05/04/2024

摘要

Low Resistivity Scaling;High Thermal Stability;Potential Interconnect Metallization

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https://doi.org/10.1063/5.0198235檢視

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題名: RuAl Intermetallic Compound of Low Resistivity Scaling and High Thermal Stability as Potential Interconnect Metallization
創作者：: Yi-Ying Fang (作者) - National Tsing Hua University
Yung-Hsuan Tsai (作者) - National Tsing Hua University
Yu-Lin Chen (顧問) - National Tsing Hua University
Dun-Jie Jhan (作者)
Ming-Yen Lu (作者)
Pei-Yuin Keng (作者) - National Tsing Hua University
守一張 (作者)
學術資源類型: 期刊文章
出版日期: 05/04/2024
出版資訊: Applied Physics Letters, 卷.124(14)
語言: 英語