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Schottky barrier height reduction at interface between GZO transparent electrode and InP/InGaAs structure by zinc driven-in step and nickel oxide insertion
Journal article   Peer reviewed

Schottky barrier height reduction at interface between GZO transparent electrode and InP/InGaAs structure by zinc driven-in step and nickel oxide insertion

Yueh-Lin Lee, Chong-Long Ho, Chi-Chen Huang and Meng-Chyi Wu
IEEE Electron Device Letters, Vol.35(12), pp.1290-1292
01/12/2014

Abstract

Ga-doped ZnO (GZO) NiOx ohmic contact RF-sputtering plasma-mode atomic layer deposition (PM-ALD) specific contact resistance zinc driven-in step
In this letter, we report the characteristics of transparent Ga-doped ZnO (GZO) electrodes contacted to the InP/InGaAs epitaxial structure both with and without a NiO x inserting layer. The GZO films deposited onto the p-InP/InGaAs structure by both radio-frequency sputtering and plasma-mode atomic layer deposition always yield Schottky contact characteristics. The barrier height improvement at the n-GZO/p-InP interface is proposed using dual zinc driven-in steps and a NiO x insertion layer to realize ohmic characteristics. The high zinc concentration (5-8 × 10 18 cm -3 ) is first obtained in the surface of the p-InP window layer via the dual zinc driven-in steps. By inserting a NiO x layer between the GZO and Au/Cr contact films, the Au/Cr/GZO/NiO x contact pad for zinc driven-in p-InP window layer and the postannealing process of 430 °C for 180 s exhibits a good ohmic contact behavior and a low specific contact resistance of 3.07 × 10 -4 Ωcm 2 .

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