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Self-aligned microbonded germanium metal-semiconductor-metal photodetectors butt-coupled to Si waveguides
Journal article

Self-aligned microbonded germanium metal-semiconductor-metal photodetectors butt-coupled to Si waveguides

Wei-Ting Chen, Chih-Kuo Tseng, Ku-Hung Chen, Han-Din Liu, Yimin Kang, Neil Na and Ming-Chang Lee
IEEE Journal on Selected Topics in Quantum Electronics, Vol.20(6), 6702444
11/2014

Abstract

Infrared detector metal-semiconductor-metal photodetectors Schottky contacts
We present a butt-coupled Germanium (Ge) metal-semiconductor-metal photodetectors on silicon (Si) waveguides. This device is implemented by a novel process using self-aligned microbonding technique and rapid-melt-growth method for monolithically integrating single-crystal Ge and Si devices on the same plane. Through inserting a thin amorphous Si (a-Si) layer between the Ge and metal contact, the Schottky barrier height is modulated, which effectively reduces the dark current and increases the operation speed. The fabricated device shows a low dark current of 0.24 μA, a 3 dB bandwidth of 15 GHz and a responsivity of 0.25 A/W, at a bias voltage of -2.6 V for wavelength 1310 nm. © 1995-2012 IEEE.

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