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Self-assembled tin dioxide for forming-free resistive random-access memory Application
Journal article   Peer reviewed

Self-assembled tin dioxide for forming-free resistive random-access memory Application

Ying-Jhan Hong, Tsang-Hsuan Wang, Shih-Yuan Wei, Pin Chang and Tri-Rung Yew
Japanese Journal of Applied Physics, Vol.55(6)
01/06/2016

Abstract

A novel resistive switching structure, tin-doped indium oxide (ITO)/SnO2%x (defined as SnO2 with oxygen vacancies)/SnS was demonstrated with a set voltage of 0.38V, a reset voltage of %0.15V, a ratio of high resistance to low resistance of 544, and forming-free and nonlinear current- voltage (I-V) characteristics. The interface of the ITO and the self-assembled SnO2%x contributed to the resistive switching behavior. This device showed great potential for resistive random access memory (RRAM) application and solving the sneak path problem in cross-bar memory arrays. Furthermore, a nanostructured resistive switching device was demonstrated successfully.

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