摘要
This study systematically investigates the formulation-property relationships of epoxy-based silver conductive adhesives by varying silver filler architecture, total filler loading, and organic carrier design. Rotational viscometry, four-point probe measurements, thermal conductivity analysis, and scanning electron microscopy (SEM) were employed to elucidate the correlations among rheological behavior, conductive network formation, and electrical-thermal transport properties. All formulations incorporate dicyandiamide (DICY) as a latent curing agent, in combination with a thermally activated accelerator and silane coupling agents, to stabilize filler-matrix interfaces and suppress moisture-assisted side reactions. This latent curing chemistry enables effective low temperature curing at approximately 155 °C, providing compatibility with temperature-sensitive flexible polymer substrates. After sealed storage at 25 °C and 60% relative humidity for two weeks, all formulations exhibited viscosity variations within ≤16%, demonstrating extended pot life and good storage stability under ambient conditions. Meanwhile, the normalized volume resistivity and thermal conductivity remained close to their initial values, with maximum relative deviations of approximately 12% and 7%, respectively, from the initial (Day 0) values across all formulations, indicating stable electrical and thermal transport properties during storage. Differences in conductive network formation and filler packing characteristics were reflected in the observed electrical and thermal transport behaviors. Balanced electrical-thermal performance was achieved without the need for high-temperature sintering or post-annealing, underscoring the effectiveness of the low temperature curing strategy. Overall, this work defines a practical formulation design window that simultaneously achieves low temperature curability, long pot life, stable rheology, and robust electrical-thermal performance. The results provide useful material-level guidelines for the development of epoxy-based silver conductive adhesives intended for conductive interconnects on flexible polymer substrates and related flexible electronic applications.