摘要
Interfacial adhesive strength is an important characteristic considered in multilayered active-matrix organic light-emitting diode (AMOLED) architecture as it has an impact on the mechanical reliability issue generated from complicated organic/inorganic hybrid lamination and final debonding procedure. Thus, an appropriate released layer design is needed to manage the capability and reliability of the encapsulated AMOLED structure de-bonded from the temporary carrier. Accordingly, this research utilizes the plasma-assisted surface modification to improve the interfacial adhesive strength of the polyimide (PI)/debonding layer (DBL) during mechanical debonding. In addition, a fracture-based finite element model of peeling testing architecture is constructed to analyze the adhesive behavior of the PI/DBL interface via the utilization of the modified virtual crack closure technique. The analytic results indicate that the suitable plasma-assisted surface modification significantly increased the nitrogen concentration and generated the high dissociation energy N–O bonds among the bonded interface between the PI/DBL thin films. The opening mode-fractured energy also takes the dominance proportion in the entire peeling load-induced interfacial energy release rate. The application of plasma-assisted surface modification enhanced the delamination resistance of the concerned interface and maintained the structural stability during the lamination and related release of a whole flexible AMOLED architecture.