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Simulating percolating behavior of conductive particles in anisotropically conductive composite films
Journal article   Peer reviewed

Simulating percolating behavior of conductive particles in anisotropically conductive composite films

S.Y. Lu and C.Y. Lin
Applied Physics A: Materials Science and Processing, Vol.74(5), pp.675-681
05/2002

Abstract

A numerical scheme is developed to simulate the percolating behavior of conductive particles within a non-conductive matrix film with a preferential alignment of particles achieved via externally imposed deterministic driving forces. The sharp transition from non-conducting to conducting of the composite film is successfully revealed with the model. The percolation behavior is studied in terms of four percolation parameters, including the percolation probability, the normalized shortest percolation path, normalized gyration radius and density of the percolation cluster, subject to variation in five important system parameters. These include particle concentration, relative importance of the externally applied force, film thickness, film width and particle size. The threshold particle concentration can be reduced by increasing the strength of the deterministic driving force, decreasing film thickness, increasing film width or using smaller size particles. Our study suggests that using stronger applied force for wider and thinner films containing smaller particles may be a good practice to obtain anisotropically conductive films with a light particle loading that possess good conduction capability in the thickness direction and good insulation in the planar direction.

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