Abstract
From theoretical analysis, two critical gaps are derived to judge the adhesion for center-anchored sector plates. However, from theory of plates-and-shells, a mathematical model of residual stress is derived. Therefore, the residual stress is also included here. Two critical gaps is obtained, three regions are located to decide the adhesive conditions between the sector plate and its underlying substrate. With different anchor and outer radii, in the regime above the h crb(s) line, devices would be adhered to the substrate. However, in the regime beneath the h cre(s) line, devices would be free. In the regime between the two lines, it is unable to determine whether sticking or not. The effect of sector angle on sticking is also studied, but showed no significance, especially for h cre(s) ,. The results show that thermal stress is a major factor of the sticking phenomena in the considered microstructure. It is concluded that residual stress has more significant effect in sticking than the sector angle. Using surface micromachining, some devices are successfully fabricated and the experimental results agree with the theoretical analysis, in general.