Stress-Induced Warpage Estimation of Advanced Semiconductor Copper Interconnect Processes

期刊文章

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昌駿李, Y.-H. Lin 和 D.-P. Yang

International Journal of Mechanical Sciences, 卷.284

12/2024

摘要

Finite element analysis;Process-oriented simulation;Equivalent residual stress;Warpage prediction

1 檢視次數

題名: Stress-Induced Warpage Estimation of Advanced Semiconductor Copper Interconnect Processes
創作者：: 昌駿李 (作者)
Y.-H. Lin (作者) - National Tsing Hua University
D.-P. Yang (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 12/2024
出版資訊: International Journal of Mechanical Sciences, 卷.284
語言: 英語