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Structural and electrical characteristics of atomic layer deposited high κ HfO2 on GaN
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Structural and electrical characteristics of atomic layer deposited high κ HfO2 on GaN

Y. C. Chang, H. C. Chiu, Y. J. Lee, M. L. Huang, K. Y. LeeM. Hong
Applied Physics Letters, 卷.90(23)
04/06/2007

摘要

electrical leakage current density

High κ HfO2 was deposited on n-type GaN (0001) using atomic layer deposition with Hf(NCH3C2H5)4 and H2O as the precursors. Excellent electrical properties of TiN/HfO2 /GaN metal-oxide-semiconductor diode with the oxide thickness of 8.8 nm were obtained, in terms of low electrical leakage current density (10−6A/cm2 at VFB+1 V), well behaved capacitance-voltage (C-V) curves having a low interfacial density of states of 2x1011 cm−2 eV−1 at the midgap, and a high dielectric constant of 16.5. C-V curves with clear accumulation and depletion behaviors were shown, along with negligible frequency dispersion and hysteresis with sweeping biasing voltages. The structural properties studied by high-resolution transmission electron microscopy and x-ray reflectivity show an atomically smooth oxide/GaN interface, with an interfacial layer of GaON ~1.8 nm thick, as probed using x-ray photoelectron spectroscopy.

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