- 題名
- Study of Electrical Breakdown Phenomena for Devices with Micron Separations
- 創作者：
- Ching-Heng Chen (作者) - National Tsing Hua UniversityJ Andrew Yeh (作者) - National Tsing Hua UniversityPei-Jen Wang (作者) - National Tsing Hua University
- 學術資源類型
- 期刊文章
- 出版日期
- 2006
- 出版資訊
- Journal of Micromechanics and Microengineering Journal of Micromechanics and Microengineering, 卷.16(7), 頁碼.1366-1373
- 語言
- 中文
期刊文章
Study of Electrical Breakdown Phenomena for Devices with Micron Separations
Journal of Micromechanics and Microengineering Journal of Micromechanics and Microengineering, 卷.16(7), 頁碼.1366-1373
2006
指標
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