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Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells
Journal article   Peer reviewed

Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells

Yu-Ting Huang, Ya-Yun Zhan, Sheng-Jye Cherng, Chih-Ming Chen, Shien-Ping Feng and Tzu-Chien Wei
Journal of the Electrochemical Society, Vol.160(9)
2013

Abstract

Plastic film is promising as a photoanode substrate of dye-sensitized solar cell (DSSC) for flexible applications, while a lowtemperature sintering process is generally adopted for the TiO 2 mesoporous film due to unstable thermal property of general plastics. This study demonstrates that typical high-temperature TiO 2 sintering can be adopted for preparing the photoanode when using a surface-metallized polyimide (PI) film. A Sn/Ni bi-layer is formed on a PI film via a chemical process as the conductive layer. The Sn/Ni-coated PI photoanode can withstand high-temperature TiO 2 sintering at a peak temperature of 430°C for 30 min without significant visual deformation due to high thermal stability of PI and strength reinforcement caused by surface metallization. The DSSC employing the Sn/Ni-coated PI film as the photoanode substrate reaches an energy conversion efficiency of 3.44% under 1 sun rear-side illumination. © 2013 The Electrochemical Society. All rights reserved.

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