Abstract
Copolyimides with siloxane moieties in the main chain were synthesized by solution polycondensation of 1,3-bis (3-aminopropyl) tetramethyldisiloxane (APMS), oxydianiline (ODA) with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) in N-methyl-2-pyrrolidone (NMP). The adhesion properties between copolyimides and silicon wafer were improved significantly with incorporation of siloxane moiety into polymer chain. Photosensitive copolyimide precursor was obtained by further reaction of silicon-containing copolyamic acid with 2-isocyanatoethyl methacrylate (IEM).