摘要
The mechanical properties of electronic devices in packaging technology are significantly affected by intermetallic compounds (IMCs). This study investigates the interfacial reaction between Ni under bump metallization and In solder at aging temperatures of 125°C, 135°C, and 145°C for different periods. Based on the energy dispersive x-ray spectrometry analysis, the growth of the IMCs is mainly Ni 3 In 7 . In addition, the square thickness of the IMCs is proportional to the aging time, which is consistent with volume diffusion control. The activation energy of the Ni 3 In 7 IMC is calculated as 165.9 kJ/mol.