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The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent
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The development of estimated methodology for interfacial adhesion of semiconductor coatings having an enormous mismatch extent

Chang-Chun LeePei-Chen Huang
Applied Surface Science, 卷.440, 頁碼.202-208
05/2018

摘要

Four-point bending test Fracture-based finite element simulation Interfacial delamination Multi-level submodeling Multi-point constraint (MPC) Surfaces Coatings and Films
The long-term reliability of multi-stacked coatings suffering the bending or rolling load was a severe challenge to extend the lifespan of foregoing structure. In addition, the adhesive strength of dissimilar materials was regarded as the major mechanical reliability concerns among multi-stacked films. However, the significant scale-mismatch from several nano-meter to micro-meter among the multi-stacked coatings causing the numerical accuracy and converged capability issues on fracture-based simulation approach. For those reasons, this study proposed the FEA-based multi-level submodeling and multi-point constraint (MPC) technique to conquer the foregoing scale-mismatch issue. The results indicated that the decent region of first and second-order submodeling can achieve the small error of 1.27% compared with the experimental result and significantly reduced the mesh density and computing time. Moreover, the MPC method adopted in FEA simulation also shown only 0.54% error when the boundary of selected local region was away the concerned critical region following the Saint-Venant principle. In this investigation, two FEA-based approaches were used to conquer the evidently scale mismatch issue when the adhesive strengths of micro and nano-scale multi-stacked coating were taken into account.

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