Abstract
In this paper, the digital photoelastic technique and finite element method (FEM) were combined to investigate the influence of embedded inclusions and voids on the distribution of interfacial stresses of bimaterial structures. A special casting procedure was employed to manufacture the bimaterial structures with and without voids and inclusions in the adherends. As indicated from the results of this paper, after introducing inclusions or voids in the adherends, the interfacial peeling stresses may become most critical. © 2004 Elsevier Ltd. All rights reserved.