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The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms
Journal article   Peer reviewed

The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms

Kuo-Cheng Huang, Wen-Tse Hsiao, Chi-Hung Hwang, Ru-Li Lin and Jer-Liang Andrew Yeh
Optics and Lasers in Engineering, Vol.67, pp.31-35
2015

Abstract

Glass substrate Laser ablation Thermal fracture cutting technology (TFCT) Ultrasonic-assisted
This study presents three hybrid processing models for cutting a glass substrate, and compares their cutting speeds. The three models are (I) thermal fracture cutting technology (TFCT)-assisted laser ablation, (II) ultrasonic-assisted laser ablation, and (III) ultrasonic and TFCT-assisted laser ablation. In the experiment, a 12 W 355 nm Nd:YVO 4 laser system, a 40 W CO 2 laser and an ultrasonic transducer were used to cut 3 mm thick soda-lime glasses. Lasers and ultrasonic transducers were used as heat sources and vibration sources, respectively. Results show that the surface morphology of the soda-lime glass sheet depends on the processing models. After cutting, the surface and cross-sectional morphology of glass substrate were observed using a portable digital microscope and residual stresses were also evaluated thanks to a photoelasticity instrument.

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