Thermal Stability and Orthogonal Functionalization of Organophosphonate Self-Assembled Monolayers as Potential Liners for Cu Interconnect

期刊文章

開放取用(OA)

同儕審查

Yu-Wei Chou, 守一張和 Pei Yuin Keng

ACS Omega, 卷.8(42), 頁碼.39699-39708

13/10/2023

PMID: 37901487

摘要

Orthogonal Functionalization;Organophosphonate

url

https://doi.org/10.1021/acsomega.3c05629檢視

已出版(紀錄版本) 開放

1 檢視次數

題名: Thermal Stability and Orthogonal Functionalization of Organophosphonate Self-Assembled Monolayers as Potential Liners for Cu Interconnect
創作者：: Yu-Wei Chou (作者)
守一張 (作者)
Pei Yuin Keng (作者) - National Tsing Hua University
學術資源類型: 期刊文章
出版日期: 13/10/2023
出版資訊: ACS Omega, 卷.8(42), 頁碼.39699-39708
語言: 英語