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Thermal performance of flat vapor chamber heat spreader
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Thermal performance of flat vapor chamber heat spreader

Shou-Shing Hsieh, Ron-Yu Lee, Jin-Cherng ShyuShao-Wen Chen
Energy Conversion and Management, 卷.49(6), 頁碼.1774-1784
06/2008

摘要

Evaporation and condensation IC cooling technology Vapor chamber heat spreader Energy Engineering and Power Technology Fuel Technology Nuclear Energy and Engineering Renewable Energy Sustainability and the Environment
Experiments were performed to examine the spreading thermal resistance of centrally positioned heat sources and the thermal performance of a water charged, gravity assisted flat vapor chamber to be used for electronic cooling. Parametric studies including different heat fluxes and operating temperatures were conducted, and the effect of the relevant parameters on the cooling performance in terms of the spreading resistance was presented and discussed. The present vapor chamber heat spreader showed a heat removal capacity of 220 W/cm 2 with a thermal spreading resistance of 0.2 °C/W. © 2007 Elsevier Ltd. All rights reserved.

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